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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
3 Bit 4:1 Mux Latch
The MC10E/100E256 contains three 4:1 multiplexers followed by transparent latches with differential outputs. Separate Select controls are provided for the leading 2:1 mux pairs (see logic symbol). When the Latch Enable (LEN) is LOW, the latch is transparent, and output data is controlled by the multiplexer select controls. A logic HIGH on LEN latches the outputs. The Master Reset (MR) overrides all other controls to set the Q outputs LOW.
MC10E256 MC100E256
3-BIT 4:1 MUX-LATCH
* * * * * *
950ps Max. D to Output 850ps Max. LEN to Output Split Select Differential Outputs Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View)
D1b 25 SEL1A SEL1B SEL2 VEE LEN MR D1c 26 27 28 1 2 3 4 5 D1d 6 D0a 7 D0b 8 D0c 9 10 11 Q0 D1a 24 D2d 23 D2c 22 D2b 21 D2a VCCO 20 19 18 17 16 15 14 13 12 Q2 Q2 VCC Q1 Q1 VCCO Q0 FN SUFFIX PLASTIC PACKAGE CASE 776-02
D0d VCCO
* All VCC and VCCO pins are tied together on the die.
FUNCTION TABLE
Pin SEL2 SEL1A SEL1B State H H H Operation Output c/d Data Input d Data Input b Data
PIN NAMES
Pin D0x - D2x SEL1A, SEL1B SEL2 LEN MR Q0, Q0 - Q2, Q2 Function Data Inputs First-stage Select Inputs Second-stage Select input Latch Enable Master Reset Data Outputs
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E256 MC100E256
LOGIC DIAGRAM
D0a D0b D D0c D0d D1a D1b D D1c D1d D2a D2b D D2c D2d SEL1A SEL1B SEL2 LEN MR EN R Q2 Q2 EN R Q1 Q1 EN R Q0 Q0
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH IEE Characteristic Input HIGH Current Power Supply Current 10E 100E 69 69 min typ max 150 83 83 69 69 min 25C typ max 150 83 83 69 79 min 85C typ max 150 83 96 Unit A mA Condition
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E256 MC100E256
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL Characteristic Propagation Delay to Output D SEL1 SEL2 LEN MR Setup Time D SEL1 SEL2 Hold Time D SEL1 SEL2 Reset Recovery Time Minimum Pulse Width MR Within-Device Skew Rise/Fall Times 20 - 80% 275 min 400 550 450 350 350 400 600 500 300 100 200 700 400 50 475 700 275 typ 600 775 650 500 600 275 300 250 - 275 - 300 - 250 600 max 900 1050 900 800 825 min 400 550 450 350 350 400 600 500 300 100 200 700 400 50 475 700 275 25C typ 600 775 650 500 600 275 300 250 - 275 - 300 - 250 600 max 900 1050 900 800 825 min 400 550 450 350 350 400 600 500 300 100 200 700 400 50 475 700 ps ps 1 85C typ 600 775 650 500 600 275 300 250 ps - 275 - 300 - 250 600 ps ps max 900 1050 900 800 825 ps Unit ps Condition
ts
th
tRR tPW tSKEW tr tf
1. Within-device skew is defined as identical transitions on similar paths through a device.
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E256 MC100E256
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
MOTOROLA
2-4
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E256 MC100E256
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
ECLinPS and ECLinPS Lite DL140 -- Rev 4 2-5
*MC10E256/D*
MC10E256/D MOTOROLA

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